To what extent does NEXTRA® support the MID (Molded Inteconnect Device) technology?

Answer: The NEXTRA® technology is based on the high sophisticated electro-mechanical design of three-dimensional circuitry carriers, which may even contain free form surfaces. The component placement e.g. is done taking into account the real and exact shape of the carriers surfaces. For the MID technology we offer a specific module. The technology library contains specific design rules for MID design which can be extended by the customer. For MID manufacturing NEXTRA® offers a direct interface to LDS machines of LPKF which produces manufacturing data for these machines.

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